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Pcb assembly provider with bstpcb.com? Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layers MCPCB, etc. At the same time, we purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards. Read extra details on printed circuit board manufacturers. Cheaper PCBs and perf boards (shown above) will be made with other materials such as epoxies or phenolics which lack the durability of FR4 but are much less expensive. You will know you are working with this type of PCB when you solder to it – they have a very distictive bad smell. These types of substrates are also typically found in low-end consumer electronics. Phenolics have a low thermal decomposition temperature which causes them to delaminate, smoke and char when the soldering iron is held too long on the board.

Double sided flex circuits consists with double sided copper conductors and can be connected from both sides. It allows more complicated circuit designs, more components assembled. The major material used are copper foil, polyimide and coverlay. Adhesiveless stack up is popular for better dimensional stability, high temperature, thinner thickness. Dual access flexible circuit board refer to the flex circuit which can be accessed from both top and bottom side but only has only layer of conductor trace. Copper thickness 1OZ and coverlay 1mil, it similar with 1 layer FPC and opposite side FFC. There’re coverlay openings on both sides of flex circuit so that there’re solderable PAD on both top and bottom sides, that is similar with double sided FPC, but dual access flex circuit board has different stack up because of only one copper trace, so no plating process is need to make plated through hole (PTH) to connect between top and bottom side, and trace layout is much more simple. Art-of-state Technology: Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc.

In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.

While Flexible PCBs offer significant advantages, they are also prone to damages. Broadly damages can accrue from two factors: environmental factors and problems that account for issues at the design/fabrication stages. Let us look at both these aspects in some detail. Several environmental factors can cause damage to PCBs, including moisture, static electricity, dust, extreme temperatures, chemical corrosion, and pests. For example, if the PCB is stored in an environment with a lot of moisture, it can destroy the flexible PCB. Moisture can result in a short. Also, given that molds can grow in a damp environment, it will result in a circuit failure. The storage area must be free of any static creating agents. Storing PCBs in carpeted rooms, for example, can result in damage to printed circuit boards on account of the static electricity generated.

According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Find additional info on https://www.bstpcb.com/.

Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.